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HSMX-C1XX
High Performance Chip LED
Data Sheet
HSMQ-C110, HSMQ-C120, HSMQ-C150, HSMQ-C170, HSMQ-C177, HSMQ-C190, HSMQ-C191, HSMQ-C197, HSMQ-C265, HSMR-C110, HSMR-C120, HSMR-C130, HSMR-C150, HSMR-C170, HSMR-C177, HSMR-C190, HSMR-C191, HSMR-C197, HSMR-C265 Description
These small chip-type LEDs utilize high efficient and high brightness InGaN material to deliver competitively priced high performance blue and green. These 520 nm green and 470 nm blue are unique hues which provide color differentiation to a product. These ChipLEDs come in either top emitting packages (HSMx-C130, C150, C170, C177, C190, C191, C197), in side emitting packages (HSMx-C110, C120) or in a reverse mount package (C265). The side emitting package is especially suitable for LCD backlighting application. The top emitting packages, with their wide viewing angle, are suitable for direct backlighting application or being used with light pipes. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel with 4000 units per reel for HSMx-C120, C130, C170, C177, C190, C191 and C197 packages, and 3000 units per reel for HSMxC110, C150 and C265 packages. All packages are compatible with IR soldering and binned by both color and intensity.
Features
* High brightness * Small size * Industrial standard footprint * Diffused optics * Top emitting or right angle emitting * Compatible with IR soldering * Compatible for use with light piping * Available in 8 mm tape on 7" diameter reel * Reel sealed in zip locked moisture barrier bags
Applications
* LCD backlighting * Push button backlighting * Front panel indicator * Symbol indicator * Microdisplays * Small message panel signage
CAUTION: HSMQ-Cxxx and HSMR-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.
Package Dimensions
LED DIE CATHODE LINE
CATHODE MARK
1.0 (0.039)
1.25 (0.049)
2.6 (0.102 )
2.0 (0.079 )
3.2 (0.126 ) CLEAR EPOXY 1.5 (0.059) PC BOARD 0.5 (0.020) POLARITY
DIFFUSED EPOXY 0.3 (0.012) PC BOARD
1.4 (0.055)
POLARITY
0.8 (0.031)
1.6 (0.063 ) 3.2 (0.126 ) 0.8 (0.031) CATHODE LINE
0.3 (0.012) CATHODE LINE 0.4 0.15 (0.016 0.006) 0.4 0.15 (0.016 0.006)
1.0 (0.039)
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C110
HSMx-C170
CATHODE MARK
CATHODE MARK
0.8 (0.031)
0.8 (0.031)
1.6 (0.063 )
1.6 (0.063 )
1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD
POLARITY 0.3 (0.012) DIFFUSED EPOXY PC BOARD 0.8 (0.031) 0.3 (0.012)
1.0 (0.039)
POLARITY
0.6 (0.023) 0.3 (0.012) CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN.
CATHODE LINE 0.3 0.15 (0.012 0.006) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN.
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C190
HSMx-C191
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
2
Package Dimensions, continued
CATHODE MARK
CATHODE MARK
1.6 (0.063)
1.25 (0.049)
3.2 (0.126 )
2.00 (0.079) POLARITY
DIFFUSED EPOXY 0.6 (0.024)
2.0 (0.079)
POLARITY
DIFFUSED EPOXY
0.40 (0.016)
1.1 (0.043) PC BOARD CATHODE LINE 0.50 0.20 (0.020 0.008) 0.5 (0.020) 0.50 0.20 (0.020 0.008)
PC BOARD
0.16 (0.006)
CATHODE LINE 0.40 0.15 (0.016 0.006) 0.40 0.15 (0.016 0.006)
1.10 (0.043) MIN.
SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C150
HSMx-C177
CATHODE MARK LED DIE
CATHODE MARK
0.3 (0.012) 0.6 (0.024)
1.6 (0.063)
0.80 (0.031)
1.60 (0.063)
POLARITY
POLARITY CLEAR EPOXY 1.2 (0.047)
DIFFUSED EPOXY
0.40 (0.016)
1.0 (0.039) PC BOARD
PC BOARD 0.16 (0.006) CATHODE LINE 0.30 0.15 (0.012 0.006)
0.5 (0.020)
3 - 0.3 (0.012) CATHODE LINE
0.70 (0.028) MIN. SOLDERING TERMINAL
SOLDERING TERMINAL
HSMx-C197
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMx-C120
3
Package Dimensions, continued
3.4 (0.134) LED DIE
0.8 (0.031)
CATHODE MARK (ETCHED)
LED DIE
CATHODE MARK
1.25 (0.049)
(0.625)
GREEN SOLDER MASK POLARITY UNDIFFUSED EPOXY 1.1 (0.043) PC BOARD 0.3 (0.012) CATHODE LINE 0.50 0.15 (0.020 0.006) 0.50 0.15 (0.020 0.006) 1.2 (0.047)
DIFFUSED EPOXY
1.6 (0.063) POLARITY 1.15 (0.045) 0.23 (0.009) 0.35 (0.014) 0.12 (0.005)
1.1 (0.043)
SOLDERING TERMINAL
HSMx-C265
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
;;
PCB BOARD CATHODE LINE 0.3 0.15 (0.012 0.006)
0.3 0.15 (0.012 0.006)
0.7 (0.028) MIN.
SOLDERING TERMINAL
HSMx-C130
Device Selection Guide
Package Dimension (mm) [1], [2] 3.2(L) x 1.5(W) x 1.0(H) 1.6(L) x 1.0(W) x 0.6(H) 1.6(L) x 0.8(W) x 0.35(H) 3.2(L) x 1.6(W) x 1.1(H) 2.0(L) x 1.25(W) x 0.8(H) 2.0(L) x 1.25(W) x 0.4(H) 1.6(L) x 0.8(W) x 0.8(H) 1.6(L) x 0.8(W) x 0.6(H) 1.6(L) x 0.8(W) x 0.4(H) 3.4(L) x 1.25(W) x 1.1(H)
Notes: 1. Dimensions in mm.
InGaN Green HSMQ-C110 HSMQ-C120 - HSMQ-C150 HSMQ-C170 HSMQ-C177 HSMQ-C190 HSMQ-C191 HSMQ-C197 HSMQ-C265
InGaN Blue HSMR-C110 HSMR-C120 HSMR-C130 HSMR-C150 HSMR-C170 HSMR-C177 HSMR-C190 HSMR-C191 HSMR-C197 HSMR-C265
Package Description Untinted, Non-diffused Untinted, Non-diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Non-diffused
2. Tolerance 0.1 mm unless otherwise noted.
Absolute Maximum Ratings at TA = 25C
Parameter DC Forward Current [1] Power Dissipation Reverse Voltage (I R = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature
Note: 1. Derate linearly as shown in Figure 4.
HSMQ-Cxxx HSMR-Cxxx 20 78 5 95 -30 to +85 -40 to +85 See reflow soldering profile (Figures 11 & 12)
Units mA mW V C C C
4
Electrical Characteristics at TA = 25C
Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.9 3.9 3.9 3.9 3.9 3.9 3.9 3.9 3.9 3.9 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 5 5 5 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 140 140 100 100 110 110 110 110 65 65 Thermal Resistance RJ-PIN (C/W) Typ. 450 450 450 450 300 300 350 350 300 300
Part Number HSMQ-C110/C150 HSMR-C110/C150 HSMQ-C120 HSMR-C120/C130 HSMQ-C170/C190/C191 HSMR-C170/C190/C191 HSMQ-C177/C197 HSMR-C177/C197 HSMQ-C265 HSMR-C265
VF Tolerance: 0.1 V
Optical Characteristics at TA = 25C
Luminous Intensity IV (mcd) @ 20 mA[1] Min. Typ. 45 45 45 45 45 18 18 18 18 18 18 150 145 145 145 140 60 55 55 55 55 45 Peak Wavelength peak (nm) Typ. 520 520 520 520 520 469 469 469 469 469 469 Color, Dominant Wavelength d[2] (nm) Typ. 527 527 527 527 527 473 473 473 473 473 473 Viewing Angle 2 1/2 Degrees[3] Typ. 130 155 140 130 150 130 155 145 140 130 150 Luminous Efficacy V (lm/w) Typ. 500 500 500 500 500 88 88 88 88 88 88
Part Number HSMQ-C110 HSMQ-C120 HSMQ-C150/170/190/191 HSMQ-C177/197 HSMQ-C265 HSMR-C110 HSMR-C120 HSMR-C130 HSMR-C150/170/190/191 HSMR-C177/197 HSMR-C265
Color Green Green Green Green Green Blue Blue Blue Blue Blue Blue
Notes: 1. The luminous intensity, IV, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d , is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Color Bin Limits[1] Blue Color Bins[1]
Bin ID A B C D
Tolerance: 1 nm
InGaN Green Color Bins[1]
Dom. Wavelength (nm) Min. Max. 460.0 465.0 465.0 470.0 470.0 475.0 475.0 480.0 Bin ID A B C D Dom. Wavelength (nm) Min. Max. 515.0 520.0 520.0 525.0 525.0 530.0 530.0 535.0
Tolerance: 1 nm Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins.
5
Light Intensity (Iv) Bin Limits[1]
Bin ID A B C D E F G H J K L M
Tolerance: 15% Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 2. The Iv binning specification set-up is for lowest allowable Iv binning only. There are no upper Iv bin limits.
Intensity (mcd) Min. Max. 0.11 0.18 0.18 0.29 0.29 0.45 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50
Bin ID N P Q R S T U V W X Y
Intensity (mcd) Min. Max. 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00
100 90
RELATIVE INTENSITY - %
80 70 60 50 40 30 20 10 0 400
BLUE
GREEN
500 WAVELENGTH - nm
600
700
Figure 1. Relative intensity vs. wavelength.
IF MAX - MAXIMUM FORWARD CURRENT - mA
100
IF - FORWARD CURRENT - mA
1.2 1.0 0.8 0.6 BLUE 0.4 GREEN 0.2 0
25
LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
20
10
15 RJ-A = 500C/W 10 RJ-A = 600C/W 5
1
BLUE
GREEN
0.1
0
2.0
2.5
3.0
3.5
4.0
0
5
10
15
20
25
0
10 20 30 40 50 60 70 80 90 TA - AMBIENT TEMPERATURE - C
VF - FORWARD VOLTAGE - V
IF - FORWARD CURRENT - mA
Figure 2. Forward current vs. forward voltage.
Figure 3. Luminous intensity vs. forward current.
Figure 4. Maximum forward current vs. ambient temperature.
6
100
RELATIVE INTENSITY - %
80
60
40
20
0 -90
-70
-50
-30
-10
10
30
50
70
90
ANGLE
100
RELATIVE INTENSITY - %
80
60
40
20
0 -90
-70
-50
-30
-10
10
30
50
70
90
ANGLE
Figure 5. Relative intensity vs. angle for HSMx-C110.
100 90
RELATIVE INTENSITY
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
100 90
RELATIVE INTENSITY
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 6. Relative intensity vs. angle for HSMx-C120.
7
100 90
RELATIVE INTENSITY - %
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 7. Relative intensity vs. angle for HSMx-C177 and C197.
100 90
RELATIVE INTENSITY - %
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 8. Relative intensity vs. angle for HSMx-C130.
100 90
RELATIVE INTENSITY - %
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 9. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150.
100 90
RELATIVE INTENSITY - %
80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
ANGLE
Figure 10. Relative intensity vs. angle for HSMx-C265.
8
10 SEC. MAX.
TEMPERATURE
230C MAX.
10 to 30 SEC.
4C/SEC. MAX.
TEMPERATURE
140-160C 4C/SEC. MAX. OVER 2 MIN. TIME
3C/SEC. MAX.
217 C 200 C 150 C
255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 3 C/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX.
Figure 11. Recommended reflow soldering profile.
TIME
(Acc. to J-STD-020C)
5.0 (0.200) 0.9 (0.035) 0.9 (0.035)
Figure 12. Recommended Pb-free reflow soldering profile.
1.0 (0.039) 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.059)
1.2 (0.047) 1.2 (0.047)
1.2 (0.047)
0.9 (0.035)
Figure 13. Recommended soldering pattern for HSMx-C110.
Figure 14. Recommended soldering pattern for HSMx-C170/177.
0.8 (0.031)
1.5 (0.059) 0.8 (0.031) 0.8 (0.031) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059)
0.7 (0.028)
Figure 15. Recommended soldering pattern for HSMx-C130/190/191/197.
Figure 16. Recommended soldering pattern for HSMx-C150.
0.4 (0.016) 0.4 (0.016)
2.2 (0.087) DIA. PCB HOLE
0.7 (0.028) 0.15 (0.006) CENTERING BOARD 0.8 (0.031) 1.2 (0.047) 0.8 (0.031)
1.25 (0.049)
1.4 (0.055)
2.3 (0.091)
1.4 (0.055)
Figure 17. Recommended soldering pattern for HSMx-C120.
NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
Figure 18. Recommended soldering pattern for HSMx-C265.
9
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 19. Reeling orientation.
O 13.1 0.5 (O 0.516 0.020)
3.0 0.5 (0.118 0.020)
178.40 1.00 (7.024 0.039)
4.0 0.5 (0.157 0.020)
6 PS
5.0 0.5 (0.197 0.020)
Figure 20. Reel dimensions.
;; ;; ;; ;; ;;; ;;
O 20.20 MIN. (O 0.795 MIN.)
8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039)
59.60 1.00 (2.346 0.039)
NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
10
DIM. A (SEE TABLE 1)
DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002)
HSMx-C110/120 POSITION IN CARRIER TAPE
;; ;;;;;; ;; ;;;;;; ;
4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 1.75 (0.069) 3.50 0.05 (0.138 0.002) 8.00 0.30 (0.315 0.012)
0.20 0.05 (0.008 0.002)
0.23 0.05 (0.009 0.002) FOR HSMR-C130
DIM. A (SEE TABLE 1)
DIM. B (SEE TABLE 1)
;;; ;;;
4.00 (0.157) R 1.0 0.05 (0.039 0.002) FOR HSMx-C110 R 0.5 0.05 (0.020 0.002) FOR HSMx-C120
CARRIER TAPE
USER FEED DIRECTION
COVER TAPE
TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM. A 0.10 (0.004) 3.40 (0.134) 1.90 (0.075) 3.50 (0.138) 2.30 (0.091) 2.30 (0.091) 1.75 (0.069) 1.85 (0.073) 1.75 (0.069)
PART NUMBER
HSMx-C110 SERIES HSMx-C120 SERIES HSMx-C150 SERIES HSMx-C170 SERIES HSMx-C177 SERIES HSMx-C190 SERIES HSMx-C191 SERIES HSMx-C197 SERIES
DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 1.20 (0.047) 1.70 (0.067) 0.75 (0.030) 1.15 (0.045) 1.27 (0.050) 1.88 (0.074) 0.95 (0.037) 1.45 (0.057) 0.60 (0.024) 1.40 (0.055) 0.90 (0.035) 0.90 (0.035) 0.85 (0.033) 0.88 (0.035) 0.60 (0.024) 0.95 (0.037)
DIM. A (SEE TABLE 1)
DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002)
;; ;;;;;; ;; ;;;;;; ;; ;;;;;
4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 1.75 (0.069) 3.50 0.05 (0.138 0.002) 8.00 0.30 (0.315 0.012) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 3.70 (0.146) 1.45 (0.057) 1.30 (0.051) HSMx-C265 SERIES
0.20 0.05 (0.008 0.002)
Figure 21. Tape dimensions.
NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
11
END
START
Convective IR Reflow Soldering
For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components.
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MOUNTED WITH COMPONENTS
THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE.
MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE.
Storage Condition: 5 to 30C @ 60% RH max.
Baking is required under the condition: a) Humidity Indicator Card is >10% when read at 23 5C b) Device exposed to factory conditions <30C/60% RH more than 672 hours. Baking recommended condition: 60 5C for 20 hours.
Figure 22. Tape leader and trailer dimensions.
NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2008 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0521EN AV02-0977EN January 10, 2008

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